International Symposium on Sputtering and Plasma Processes (ISSP) was established in 1991. The 1st symposium was held in Tokyo, and the main subject was “Reactive Sputtering”. It was the time, some new approaches to improve deposition rate and stability of the reactive sputtering process were started to be addressed. Since then, the symposium has been held biennially. At each symposium, the current topics and trends concerning sputtering and plasma processes have become the main focus and such topics have been discussed intensively. This time, we focus on discussion towards a connected future. Physical meeting was successfully came back in 2024 in Kyoto and will be continued in 2026. Here are the subjected areas of ISSP2026; 

官網：https://www.issp-jvss.org/

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